DENKA

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Product Information

DENKA ALSINK

Product Information

Outline

it is drawing attention as a substitute for ceramics and metals like Al and Cu/Mo alloys

Characteristics

Al-Al-SiC has a coefficient of thermal expansion similar to that of alumina (Al2O3) and thermal conductivity as high as that of aluminum nitride (AIN)

사용

  • Base boards for power modules such as IGBT and diodes that require high reliability (heat sinks)
  • Heat-dissipating lids for semiconductor packages such as CPUs (heat spreaders)
  • Components for microwave devices such as optical and communication devices
  • Components for semiconductor and LCD panel manufacturing equipment

Feature

DENKA ALSINK achieved excellent ease of fabrication and plating by coating the surface of MMC with a 10 to 150 μm Al-alloy layer

Product specifications and basic properties

Comparison of physical properties

관련 정보

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Electronic Products Dept
TEL
+81-3-5290-5542
FAX
+81-3-5290-5621
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