DENKA ALSINK
Product Information
Outline
it is drawing attention as a substitute for ceramics and metals like Al and Cu/Mo alloys
Characteristics
Al-Al-SiC has a coefficient of thermal expansion similar to that of alumina (Al2O3) and thermal conductivity as high as that of aluminum nitride (AIN)
사용
- Base boards for power modules such as IGBT and diodes that require high reliability (heat sinks)
- Heat-dissipating lids for semiconductor packages such as CPUs (heat spreaders)
- Components for microwave devices such as optical and communication devices
- Components for semiconductor and LCD panel manufacturing equipment
Feature
DENKA ALSINK achieved excellent ease of fabrication and plating by coating the surface of MMC with a 10 to 150 μm Al-alloy layer
Product specifications and basic properties
Comparison of physical properties
관련 정보
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