DENKA ALSINK (Al-Diamond MMC type)
Product Information
Outline
카지노 룰렛 게임uot;DENKA ALSINK(Al-Diamond MMC type)카지노 룰렛 게임uot; is composites consisting of aluminum and diamond
Characteristics
- Lightweight: 1/3 weight of the copper base board
- 500W/m K : Copper base plate par or more high thermal conductivity
- Ideal for heat dissipation of GaN semiconductor
- The best Alternative of copper-alloy material(Cu/W
사용
heat dissipation element of high frequency device for communication satellite
Feature
Representative values of physical properties
Comparison table between Al-Diamond MMC type and competing heat sink materials
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