DENKA SPHERICAL ALUMINA
Product Information
Outline
developed by Denka’s unique high temperature melting technologies
Denka spherical alumina can provide high thermal conductivity and improvement of the surface hardness of the various resins or rubbers by filling them
This can be used in the electronic materials field where reliability is required
Characteristics
- and can also control wear in kneading machines or molds compared with irregular-shaped fillers
- The particle distribution can be adjusted according to use (particle diameter: Submicron-100μm micrometer)
- It is possible to propose powder composition with different materials such as Denka spherical magnesia
- Various surface treatments are possible
사용
Thermal conductive filler for thermal interface material
- Heat dissipation pad for lithium-ion batteries for electric vehicles and hybrid vehicles
- Heat dissipation sheet for various semiconductor packages
- High thermal paste for 5G communication base stations
- High thermal paste for in-vehicle electrical equipment
Filler of Epoxy Molding Compounds for semiconductor packages
Filler of Thermal plastic
Powder for mold release of ceramics sintering
Abrasive grain.
silicon wafer and various electronic substrates
Thermal Spraying.
Filler of Heat-dissipating paint
관련 정보
Spherical Alumina/DAM Grade
표준 유형
Spherical Alumina/DAW Grade
Low Na+ Type
Super Fine Spherical Alumina/ASFP grade
- s responsibility to always test products before use and confirm their fitness for purpose and safety
- Any product contained on this Website or any product using a product contained on this Website should be disposed of in accordance with laws and regulations
- and other information by using the technical documentation and Material Safety Data Sheet
- The information contained in this website is subject to change without notice as new knowledge becomes available