DENKA

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Product Information

ELEGRIP TAPE (Dicing Tape)

Product Information

Outline

Elegrip dicing tape is used widely in a variety of applications including silicon and GaAs semiconductors (compound semiconductors)

Characteristics

  • Excellent control to back-side chipping and chip fly-off
  • Excellent over-time stability (T Series)
  • Excellent adhesiveness (shape-following properties)
  • High performance to EMCs (Epoxy Mold Compounds) and other types of difficult-to-adhere work- pieces
  • Excellent expandability and smooth peeling

Contact Us

Innovative Products

High Functional Adhesive Materials Dept
TEL
+81-3-5290-5560
FAX
+81-3-5290-5306
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  • and other information by using the technical documentation and Material Safety Data Sheet
  • The information contained in this website is subject to change without notice as new knowledge becomes available